- High degree of Expertise in High speed PCB designs.
- High speed digital, Analog, mixed digital/analog, RF designs.
- High Layer count (36 layers), High density designs.
- In house and onsite support.
- Around 2500 complex board Designed
- Components creations as per IPC 7351 & IEEE Standards.
- All high-speed interface routing experience
- Innovative Designs includes 0.37 mm Fine pitch BGAs
- Designs with Micro Vias, Blind Vias, Buried Vias and back drill.
- Single sided, 2 layer and Multilayer till 36 Layers PCB’s Designed.
- Fine Line Design Technologies – 2mil/2mil
- Supporting Fabrication process
- Co-ordinate with assembly unit
- Signal Integrity Analysis
- Design Analysis and implementation of timing critical designs
- 10Gbps routing experience
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