Capabilities

• High degree of Expertise in High speed PCB designs.
• High speed digital, Analog, mixed digital/analog, RF designs.
• High Layer count (36 layers), High density designs.
• In house and onsite support.
• Around 2500 complex board Designed
• Components creations as per IPC 7351 & IEEE Standards.
• All high-speed interface routing experience
• Innovative Designs includes 0.37 mm Fine pitch BGAs
• Designs with Micro Vias, Blind Vias, Buried Vias and back drill.
• Single sided, 2 layer and Multilayer till 36 Layers PCB’s Designed.
• Fine Line Design Technologies – 2mil/2mil
• Supporting Fabrication process
• Co-ordinate with assembly unit
• Signal Integrity Analysis
• Design Analysis and implementation of timing critical designs
• 10Gbps routing experience