Archives: services

Assembly

We are pleased to introduce ourselves as one of the major Electronic Manufacturing and Design Services provider Bangalore, the Silicon Valley of India. Unico Design Services is situated at kasthuriNagar, Bangalore. We have tie-up with all major Assembly houses, which would be able to meet current and future demands of Electronics Industries within and outside India. We provide comprehensive and cost-effective Assembly of All types SMT and through hole component PCB’s.

Thermal Analysis

• Board Level Thermal Design, simulation and analysis
• PCB data import through IDF files available from all EDA tools.
• Component Junction and case temperature computation.
• Thermal profiles generation for components and PCB

Fabrication

Searching for a quick-turn prototypes PCB manufacturer? Well, search no more, Unico Design Services is here for you, tell us your requirements we will get it done for you right away!

Unico Design Services is built on the idea of providing solutions to all your printed circuit board (PCB) prototyping needs. We are a reliable and supportive working partner for our customers, we wants to help you to turn your designs or prototypes into reality and to achieve your goals on the GO! Our express PCB service can produce your 2 layer boards within 10 hours and 4 layers in 24 hours. With years of continuous innovations in technologies and staff development we are able to support both quick-turn sample and mass production to offer you a complete PCB solution. We will personally reply your email as soon as it is processed, for feedback on your quotation or technical enquiries. Don’t let PCB prototype keep you waiting.

SI Analysis

UDS is experienced in cutting-edge technologies and access to latest tools; we can do SI / EMI analysis for the PCBs we design and third party designs.

• Pre-route and post-route SI Analysis
• Reflection Waveform Analysis and determination of termination scheme.
• Generation of layout constraints & guidelines.
• crosstalk analysis
• Propagation delay and timing analysis
• Eye Diagram Analysis
• Multi-board analysis
• Verification by extraction of actual PWB parasitic.
• Placement optimization based on signal flow & trace length requirement of the specific interface.
• Layer stack up recommendation.

SCHEMATIC

• We can create schematics from PDF
• We can create schematics from hand written drawings
• Extract BOM from PDF version of schematics

PCB Layout

• HIGH SPEED DIGITAL, RF, POWER, MIXED SIGNAL, RF DESIGNS
• Interfaces – DDR4, SFP, Ethernet, HDMI, USB
• Controlled Impedance: Single Ended / Differential.
• High Layer count (36 layers), High density designs.
• Components more than 9000/BOARD, Connections more than 80000/BOARD
• FP creation as per IPC7351 (A,B and C) including if any customer specifications standards.
• High speed interconnects: 10 Gbps.
• Critical and associated Components placement.
• Fine pitch BGA upto 0.37mm, 2mil/2mil technology
• Designs with Micro Vias, Blind Vias, Buried Vias and backdrill.
• Stringent Thermal, Mechanical and Electrical requirements
• Routing and Length matching of critical signals.
• Generating Length reports of signals.
• Gerber Setting and Fab, Assembly output Generation in 274X and ODB++ Format