- HIGH SPEED DIGITAL, RF, POWER, MIXED SIGNAL, RF DESIGNS
- Interfaces – DDR4, SFP, Ethernet, HDMI, USB
- Controlled Impedance: Single Ended / Differential.
- High Layer count (36 layers), High density designs.
- Components more than 9000/BOARD, Connections more than 80000/BOARD
- FP creation as per IPC7351 (A,B and C) including if any customer specifications standards.
- High speed interconnects: 10 Gbps.
- Critical and associated Components placement.
- Fine pitch BGA upto 0.37mm, 2mil/2mil technology
- Designs with Micro Vias, Blind Vias, Buried Vias and backdrill.
- Stringent Thermal, Mechanical and Electrical requirements
- Routing and Length matching of critical signals.
- Generating Length reports of signals.
- Gerber Setting and Fab, Assembly output Generation in 274X and ODB++ Format
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