PCB Layout

PCB Layout

  • HIGH SPEED DIGITAL, RF, POWER, MIXED SIGNAL, RF DESIGNS
  • Interfaces – DDR4, SFP, Ethernet, HDMI, USB
  • Controlled Impedance: Single Ended / Differential.
  • High Layer count (36 layers), High density designs.
  • Components more than 9000/BOARD, Connections more than 80000/BOARD
  • FP creation as per IPC7351 (A,B and C) including if any customer specifications standards.
  • High speed interconnects: 10 Gbps.
  • Critical and associated Components placement.
  • Fine pitch BGA upto 0.37mm, 2mil/2mil technology
  • Designs with Micro Vias, Blind Vias, Buried Vias and backdrill.
  • Stringent Thermal, Mechanical and Electrical requirements
  • Routing and Length matching of critical signals.
  • Generating Length reports of signals.
  • Gerber Setting and Fab, Assembly output Generation in 274X and ODB++ Format
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