PCB Layout

• HIGH SPEED DIGITAL, RF, POWER, MIXED SIGNAL, RF DESIGNS
• Interfaces – DDR4, SFP, Ethernet, HDMI, USB
• Controlled Impedance: Single Ended / Differential.
• High Layer count (36 layers), High density designs.
• Components more than 9000/BOARD, Connections more than 80000/BOARD
• FP creation as per IPC7351 (A,B and C) including if any customer specifications standards.
• High speed interconnects: 10 Gbps.
• Critical and associated Components placement.
• Fine pitch BGA upto 0.37mm, 2mil/2mil technology
• Designs with Micro Vias, Blind Vias, Buried Vias and backdrill.
• Stringent Thermal, Mechanical and Electrical requirements
• Routing and Length matching of critical signals.
• Generating Length reports of signals.
• Gerber Setting and Fab, Assembly output Generation in 274X and ODB++ Format